SFP-DD MSA Group Revision 5.0 specifications introduce SFP112 and SFP-DD112

Nov. 11, 2021
The SFP112 will support 112 Gbps and the SFP-DD112 delivers an aggregate rate of 224 Gbps.

The Small Form Factor Pluggable Double Density (SFP-DD) Multi-Source Agreement (MSA) Group has issued Revision 5.0 of its hardware specifications and drawings. Key elements of the revision include the introductions of the SFP112 and SFP-DD112 pluggable module formats. The SFP112 will support 112 Gbps and the SFP-DD112 delivers an aggregate rate of 224 Gbps. This new revision also enables compatibility from SFP28/SFP56 to SFP112 and SFP-DD to SFP-DD112.

Copies of the specification are available on the SFP-DD MSA website.

The SFP-DD MSA revision 5.0 hardware specification contains what the group describes as significant signal integrity enhancements to address 112 Gbps differential signaling and includes three new clauses:

  1. Chapter 5 for SFP112 electrical and management interface requirements
  2. Chapter 8 for SFP-DD 112G mechanical and board definition
  3. Chapter 9 for SFP112 mechanical and board definition.

The revision also includes an ePPS/Clock signal definition for SFP-DD/SFP-DD112. Meanwhile, TS-1000 Normative Module and Connector performance requirements for SFP112 now appear in Appendix A.

The new Revision 5.0 maintains the industry’s ability to leverage single-channel and two-channel SFP form factors as requirements evolve, according to the MSA. SFP-DD host equipment ports will be able to reliably host SFP112 modules, for example. Meanwhile, SFP+ and SFP-DD power capability will remain aligned with trends and technologies, the group asserts.

SFP-DD MSA promoters include Alibaba Group, Broadcom, Cisco, Dell Technologies, Hewlett Packard Enterprises, Huawei, II-VI Incorporated, Intel, Juniper Networks, Lumentum, Molex, Nvidia and TE Connectivity. Contributors include Accelink, Amphenol, AOI, Eoptolink, Foxconn Interconnect Technology, Fourte International, Genesis Connected Solutions, Hisense Broadband, Infinera, InnoLight, Maxim Integrated, Multilane, Nokia, Senko, Source Photonics, US Conec, Yamaichi Electronics, and ZTE.

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About the Author

Stephen Hardy | Editorial Director and Associate Publisher, Lightwave

Stephen Hardy is editorial director and associate publisher of Lightwave and Broadband Technology Report, part of the Lighting & Technology Group at Endeavor Business Media. Stephen is responsible for establishing and executing editorial strategy across the both brands’ websites, email newsletters, events, and other information products. He has covered the fiber-optics space for more than 20 years, and communications and technology for more than 35 years. During his tenure, Lightwave has received awards from Folio: and the American Society of Business Press Editors (ASBPE) for editorial excellence. Prior to joining Lightwave in 1997, Stephen worked for Telecommunications magazine and the Journal of Electronic Defense.

Stephen has moderated panels at numerous events, including the Optica Executive Forum, ECOC, and SCTE Cable-Tec Expo. He also is program director for the Lightwave Innovation Reviews and the Diamond Technology Reviews.

He has written numerous articles in all aspects of optical communications and fiber-optic networks, including fiber to the home (FTTH), PON, optical components, DWDM, fiber cables, packet optical transport, optical transceivers, lasers, fiber optic testing, and more.

You can connect with Stephen on LinkedIn as well as Twitter.

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