Lightwave Logic touts new thermal design for polymer-based modulators
Lightwave Logic, Inc. (OTCQX: LWLG), which is developing proprietary electro-optic polymers for high-speed, low-power optical communications applications, says it has developed new thermal design properties that will aid the production of its Polymer Plus and Polymer Slot modulators.
"High-temperature thermal performance is one measure of robustness and a key metric commonly discussed with potential customers for fiber-optic data center and telecommunications applications," explained Dr. Michael Lebby, Lightwave Logic’s CEO. "Our in-house team successfully created a 2X improvement in r33, while allowing higher stability during poling and post-poling. This provides not only better thermal performance, but also enables greater design flexibility in high-volume silicon foundry PDK [process development kit] processes. This is critical as we seek to make our technology ubiquitous throughout the marketplace.
"Preliminary results suggest that Lightwave Logic's recently developed electro-optic polymer material, designed based on customer input, displays unrivaled thermal performance tolerance as compared to any commercial solution in use today. We look forward to receiving feedback on this exciting new material from our potential customers," concluded Lebby.
Lightwave Logic has pursued development of polymers for communications applications for a number of years. Its most recent research has focused on improving the ability to reliably produce polymer-based modulators using standard silicon processes within photonic integrated circuits (see, for example, “Lightwave Logic says new patent enables mass-volume manufacturing of polymer modules”). The Polymer Plus design sees the polymer added as a layer of the PIC wafer, whereas the Polymer Slot sees a smaller amount of polymer laid into a “slot” within a wafer layer, surrounded by other material.
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Stephen Hardy | Editorial Director and Associate Publisher, Lightwave
Stephen Hardy is editorial director and associate publisher of Lightwave and Broadband Technology Report, part of the Lighting & Technology Group at Endeavor Business Media. Stephen is responsible for establishing and executing editorial strategy across the both brands’ websites, email newsletters, events, and other information products. He has covered the fiber-optics space for more than 20 years, and communications and technology for more than 35 years. During his tenure, Lightwave has received awards from Folio: and the American Society of Business Press Editors (ASBPE) for editorial excellence. Prior to joining Lightwave in 1997, Stephen worked for Telecommunications magazine and the Journal of Electronic Defense.
Stephen has moderated panels at numerous events, including the Optica Executive Forum, ECOC, and SCTE Cable-Tec Expo. He also is program director for the Lightwave Innovation Reviews and the Diamond Technology Reviews.
He has written numerous articles in all aspects of optical communications and fiber-optic networks, including fiber to the home (FTTH), PON, optical components, DWDM, fiber cables, packet optical transport, optical transceivers, lasers, fiber optic testing, and more.
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