Opnext launches 10 Gigabit Ethernet XENPAK modules at ECOC

Sept. 7, 2004
September 7, 2004 Stockholm, Sweden--Optical component supplier Opnext has extended its line of 10 Gigabit Ethernet XENPAK modules with the introduction of a 10GBASE-DWDM module and a 10GBASE-ZR module.

September 7, 2004 Stockholm, Sweden--Optical component supplier Opnext has extended its line of 10 Gigabit Ethernet XENPAK modules with the introduction of a 10GBASE-DWDM module and a 10GBASE-ZR module. The ZR and DWDM XENPAK modules deliver a new level of performance and interoperability for high bandwidth IP transport for 80-km distances, according to the company. These modules, which enable high bandwidth IP transport in metro applications, are now shipping to network and service providers.

The 10GBASE-ZR XENPAK module supports industry-leading optical performance characteristics over 80-km fiber links. The DWDM XENPAK offers ITU-T 100-GHz grid spacing and an extended dispersion tolerance up to 1600 ps/nm. These products are based on Opnext's universal optical subassembly platform.

"Opnext is focused on three key areas of component design: lower cost, higher performance and quality, and innovative optical packages and devices," said Edward Cornejo, director of product marketing for Opnext. "The new modules provide additional margin at 80 km, reducing interoperability issues in long-reach applications. The exceptional performance and interoperability of these modules are essential critical factors in Ethernet systems."

In addition to enabling high bandwidth IP transport, the new modules will provide IP based backbone technology for service providers looking to replace expensive SONET-based backbones. Opnext's full portfolio of XENPAK modules enables its customers to make infrastructure improvements. As the industry moves toward next generation 10 GbE enterprise switches, Opnext will continue to support XENPAK, X2 and XFP transceivers.

The new modules, along with a full suite of pluggable transceivers, are on display at the Opnext booth (#137) during the European Conference on Optical Communications (ECOC), held here September 6-8, 2004.

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