JANUARY 30, 2007 -- Molex Inc. (search for Molex) has announced the development of the SFP+ Interconnect System, which meets the next-generation small form factor (SFF) 8431 specification and reaches 10-Gbit/sec speeds using the same port space as a standard SFP system. The SFP+ (search for SFP+) also occupies 30% less space than a standard XFP system, offering a higher data density than standard SFP and XFP products, say Molex representatives.
"The Molex SFP+ Interconnect System was specifically designed to address cost, power, and size issues," reports Dave Stevenson, product manager, Molex Inc. "The high-density, compact SFP+ Interconnect System delivers excellent signal integrity as well as superior EMI containment to meet a variety of 10-Gbit/sec application needs."
The SFP+ Interconnect System was developed to support applications for 8-Gbit/sec Fibre Channel and 10-Gigabit Ethernet (10-GbE). It is also well-suited for networking, storage, and telecommunications applications, claims the company.
To help customers make the most of their PCB real estate, the SFP+ Interconnect System also features:
- The SFP+ 20-circuit host connector boasts a high-speed contact design that supports 10-Gbits/sec to meet the speed requirements of the new SFF specification. It features an SMT design that is packaged in tape and reel for pick-and-place processing. The connector is also available in 15- or 30-µ gold plating to accommodate performance and cost preferences. Additionally, lubricated contacts are offered for extended life and harsh environment applications and applications that require telecom reliability levels, note Molex representatives.
- The SFP+ single layer ganged cages provide improved EMI shielding to the bezel, featuring an advanced 360 ° gasket design available in elastomeric or metal spring finger versions, each with multiple EMI ground pin locations. Single-port cages utilize the same metal spring finger design as used on the ganged cages. Available in press-fit, solder post, and PCI (1 ° ) versions, they offer customers a flexible option for use with various board thicknesses and assembly processes and, ultimately, result in lower applied cost, explains the company. The press-fit tails accommodate belly-to-belly applications for both single and ganged cages to ensure the best use of PCB real estate. Optional rear- or side-mounted light pipe cover assemblies allow for flexibility of PCB signal routing for LEDs.
- A high-speed contact wafer design allows the SFP+ stacked multi-port connectors to support speeds up to 10 Gbits/sec. The SFP+ stacked multi-port connectors offer complete integration of the connector within a cage. They measure 25.50-mm (1.39") in height and provide two rows of belly-to-belly vertically stacked SFP+ ports to ensure easy removal of the module from the port. The connectors integrate 2, 4, 8, 10, or 12 SFP+ ports and lightpipes into one assembly for increased port density and reduced assembly labor. These connectors are used with SMT LEDs to provide the user activity feedback and port status.
- Customers can also choose from two options for superior EMI shielding--either a shroud with an elastomeric gasket or a metal gasket with EMI fingers. The SFP+ stacked multi-port connector features press-fit termination to the PCB, which eliminates the need for soldering, lowers applied costs, and avoids solder-related issues.
- The Molex copper SFP+ patch cables are available in active and passive designs to provide design flexibility for up to 10 Gbits/sec at up to 22 m. The active cables appear to a host system as an optical module to reduce costs. Optional active circuitry requires no special driver circuitry that optical modules would require. I2C interface and on-board EEPROM enables the host to detect/configure for specific performance characteristics to provide LOS and Transmit disable, as well as offer a number of other host management capabilities. A re-designed pull latch allows easy access to delatch the cable from the connector for belly-to-belly use and ensures the highest possible port density.
- Additionally, the SFP+ Patch Cables offer an EMI girdle for superior EMI performance up to 10-Gbit/sec data transmission, reports the company. With similar mechanical dimensions to a standard SFP cable, the cables are interchangeable with older SFP designs to give customers the flexibility to gradually increase the capabilities of their existing systems.
The SFP+ Interconnect System is scheduled to launch in Spring 2007 and is currently being sold in custom designs only.
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