Essient addresses transponder vendors at Lightspeed's 'Hot Startups'

21 November 2002 -- At the forthcoming Lightspeed Europe conference, Dr. Simon Hicks, CTO of Essient, Glasgow, (www.esssient.com) will describe how his company's use of indium phosphide enables a significant change in both economic and technical structures.

Hicks will present "Unlockin Transponder Value using Ultra-Low Power Integrated Optoelectronics & Electronics." The conference will run from 3-5 December in London, and Dr. Hicks will speak on Wednesday, 4 December 4, at 10:15, as part of the Tomorrow's Technology Hot Startups Track.

Essient, a supplier of integrated III-V optoelectronic components, recently introduced the Essient EA-MDA-10G - Electro Absorption Modulator-Detector with Integrated Amplification at 10Gbps, its first product. Essient will also be exhibiting at the show, Booth #324.

During his presentation, Hicks will explore the benefits and challenges facing the integration of optoelectronics and electronics, and will illustrate how Essient's technology, realized through a fables manufacturing model, can enhance electronic transceivers at 2.5, 10 and 40Gbit/s.

Through monolithic integration, Essient has combined electronic and optoelectronic functions on a single chip using standard III-V fabrication processes, resulting in reduced module costs, power requirements and module size.

Previously, Hicks was COO at Kelvin Nanotechnology, during which time he built the company from initial creation to having a worldwide customer list of more than 50 companies. He has over 10 years' experience in R&D of fabrication processes for the high frequency electronics sector and the optoelectronics sector, concentrating mainly on optical WDM devices.