Phononic non-hermetic compatible thermoelectric cooler targets telecom, datacom laser packages

Phononic now offers a Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform for use alongside communications lasers for telecom and datacom applications. The TEC platform enables high reliability and cooling performance with low power consumption, according to the company.

"Laser performance can be significantly hindered by environmental challenges inside laser packages," said Kevin Granucci, general manager and vice president of sales, Phononic. "Humidity, condensation, corrosion, and even ice formation are all potential impediments that can degrade laser slope efficiency or increase coupling losses, which reduce data transmission rate, reach, and the usable lifetime of a TOSA. Hermetic packaging to safeguard against these conditions has historically been challenging and expensive to implement. Non-hermetic laser packaging that not only overcomes reliability and cost obstacles, but is cooled as well, could greatly advance today's optical communications technology, further accelerating the global transition to wireless 5G networks."

The company asserts the new TEC platform aids in the development of non-hermetic laser packages. Phononic says its team of thermal engineers can help develop customized TEC implementations that will meet the requirements of their customers' design teams. The result is an optimal TEC implementation for non-hermetic package designs that remains insulated from the affects of high humidity and heat, the company concludes.

"Optical components and module suppliers are under pressure to both rapidly innovate optical communications technology, and at the same time meet aggressive price points to keep up with competition," said Vladimir Kozlov, founder and CEO of market research firm LightCounting, via a Phononic press release. "These trends have led to increased demand for more cost-effective sub-components."

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