OIF has published the Implementation Agreement (IA) for Common Electrical I/O (CEI) 5.0 focused on 112-Gbps electrical interconnects. The IA specifies transmitter, receiver, and channel requirements for Extra Short Reach (XSR), Medium Reach (MR), and Long Reach (LR) interfaces for multi-chip-module, chip-to-chip, and high-speed backplane applications.
“This IA marks a new generation of specifications for 112G interfaces,” said Klaus-Holger Otto of Nokia, who is OIF Technical Committee chair. “It is a continuation of OIF’s proud history of adding next-generation data rates that enable broad interconnect solutions and are critical building blocks for several industry standards and platforms.”
“These new data-rate specifications will enable applications including backplane, chip-to-chip, and die-to-die interfaces within a package,” added David Stauffer of Kandou Bus, chair of OIF’s Physical and Link Layer (PLL) Working Group. “And it enables multiple applications, such as co-packaged optics. Definitions of interfaces within co-packaged die are unique to this IA and OIF’s work.”
CEI 5.0 follows on from CEI 4.0 for 56-Gbps interconnects, which OIF released in 2018 (see “OIF publishes CEI 4.0 for CEI-56G 56-Gbps applications”). The new IA is part of a busy opening six months of 2022 for OIF, which also took control of Common Management Interface Specification (CMIS) development from the QSFP-DD MSA and issued updated CMIS specifications (and started a follow-on project), completed a framework IA for co-packaging, and launched six new projects.
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