TRUMPF Photonic Components plans 56G VCSEL and photodiode demo at ECOC 2021

Aug. 26, 2021
The company says its VCSELs and photodiodes have been developed for extended temperature performance based on an upgraded manufacturing platform with enhanced process control and improved yields.

TRUMPF Photonic Components, part of the TRUMPF Group, says it plans to demonstrate its 56-Gbps VCSEL and photodiode functioning as a link supported by a transimpedance amplifier (TIA) and VCSEL driver at ECOC 2021 in Bordeaux, France.

The company says its VCSELs and photodiodes have been developed for extended temperature performance based on an upgraded manufacturing platform with enhanced process control and improved yields. The VCSELs feature fully passivated die and additional mechanical protection for the mesa for enhanced reliability. The companion photodiode features low dark current and additional ground pad for better shielding as well as ground-signal or signal-ground options for mounting. The combined feature set offers reduced cost for data center and high-performance computing applications, both from the reduced energy cost from less cooling as well as a reduction in device-related failures in the field.

“With our strong heritage in VCSEL and photodiode technology, we are continuously working to push the boundaries of what is possible,” commented Ralph Gudde vice president of marketing and sales. “While we are pleased to offer expanded temperature range on our devices up to 56 Gbps today, we are now focusing on bringing our 112-Gbps solutions to the market early next year, with first samples targeted for December 2021.”

The 56-Gbps VCSEL and photodiode demonstration at ECOC will take place in Booth 501.

For related articles, visit the Optical Technologies Topic Center.

For more information on optical components and suppliers, visit the Lightwave Buyer’s Guide.

To stay abreast of optical communications technology, subscribe to Lightwave’s Enabling Technologies Newsletter.

About the Author

Stephen Hardy | Editorial Director and Associate Publisher, Lightwave

Stephen Hardy is editorial director and associate publisher of Lightwave and Broadband Technology Report, part of the Lighting & Technology Group at Endeavor Business Media. Stephen is responsible for establishing and executing editorial strategy across the both brands’ websites, email newsletters, events, and other information products. He has covered the fiber-optics space for more than 20 years, and communications and technology for more than 35 years. During his tenure, Lightwave has received awards from Folio: and the American Society of Business Press Editors (ASBPE) for editorial excellence. Prior to joining Lightwave in 1997, Stephen worked for Telecommunications magazine and the Journal of Electronic Defense.

Stephen has moderated panels at numerous events, including the Optica Executive Forum, ECOC, and SCTE Cable-Tec Expo. He also is program director for the Lightwave Innovation Reviews and the Diamond Technology Reviews.

He has written numerous articles in all aspects of optical communications and fiber-optic networks, including fiber to the home (FTTH), PON, optical components, DWDM, fiber cables, packet optical transport, optical transceivers, lasers, fiber optic testing, and more.

You can connect with Stephen on LinkedIn as well as Twitter.

Sponsored Recommendations

Advances in Fiber & Cable

Oct. 3, 2024
November 7, 2024 1:00 PM ET / 12:00 PM CT / 10:00 AM PT / 6:00 PM GMT Duration: 1 hour Already registered? Click here to log in. A certificate of attendance...

How AI is driving new thinking in the optical industry

Sept. 30, 2024
Join us for an interactive roundtable webinar highlighting the results of an Endeavor Business Media survey to identify how optical technologies can support AI workflows by balancing...

Advancing Data Center Interconnection

July 25, 2024
Data Center Interconnect (DCI) solutions provide physical or virtual network connections between remote data center locations. Connecting geographically dispersed data centers...

The AI and ML Opportunity

Sept. 30, 2024
Join our AI and ML Opportunity webinar to explore how cutting-edge network infrastructure and innovative technologies can meet the soaring demands of AI memory and bandwidth, ...