Teramount, Hisense to partner on fiber to silicon photonics attachment

June 6, 2019
Teramount, which specializes in fiber-to-silicon connectivity technology, and Hisense Broadband Multimedia Technology have signed an agreement though which Hisense Broadband will use Teramount’s PhotonicPlug approach in its optical module products.

Teramount, which specializes in fiber-to-silicon connectivity technology, and Hisense Broadband Multimedia Technology have signed an agreement though which Hisense Broadband will use Teramount’s PhotonicPlug approach in its optical module products. PhotonicPlug enables the connection of fiber to silicon photonics subassemblies using standard equipment, according to Teramount. Dr. Wei-Ping Huang, chief scientist of Hisense Broadband, and Hesham Taha, CEO of Teramount, signed the agreement at a ceremony in Tel Aviv.

"As optical solutions for data centers and other markets continue to require higher speeds and higher bandwidth, connecting fiber to silicon is one of the main challenges of the industry," said Dr. Huang. "Teramount's PhotonicPlug provides an innovative solution to this challenge."

"We are excited to partner with a world-class industry leader such as Hisense Broadband Multimedia Technology and to collaborate towards implementing advanced optical solutions which are necessary to support the growing bandwidth and requirements of many industry segments," added Teramount’s Taha. Taha co-founded Teramount alongside CTO Dr. Avi Israel.

Teramount says its patent-pending PhotonicPlug technology can improve attachment of optical fiber to silicon in such applications as optical transceivers, co-packaged optics for switches, and laser integration. The approach enables passive alignment of the fiber to the silicon at tolerances of ±20 µm, thus making it compatible with standard CMOS assembly lines, the company explains. Teramount’s Wide Band PhotonicBump on optical chip design enables surface coupling as an alternative to edge coupling, the company adds.

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About the Author

Stephen Hardy | Editorial Director and Associate Publisher, Lightwave

Stephen Hardy is editorial director and associate publisher of Lightwave and Broadband Technology Report, part of the Lighting & Technology Group at Endeavor Business Media. Stephen is responsible for establishing and executing editorial strategy across the both brands’ websites, email newsletters, events, and other information products. He has covered the fiber-optics space for more than 20 years, and communications and technology for more than 35 years. During his tenure, Lightwave has received awards from Folio: and the American Society of Business Press Editors (ASBPE) for editorial excellence. Prior to joining Lightwave in 1997, Stephen worked for Telecommunications magazine and the Journal of Electronic Defense.

Stephen has moderated panels at numerous events, including the Optica Executive Forum, ECOC, and SCTE Cable-Tec Expo. He also is program director for the Lightwave Innovation Reviews and the Diamond Technology Reviews.

He has written numerous articles in all aspects of optical communications and fiber-optic networks, including fiber to the home (FTTH), PON, optical components, DWDM, fiber cables, packet optical transport, optical transceivers, lasers, fiber optic testing, and more.

You can connect with Stephen on LinkedIn as well as Twitter.

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