Broadcom Corp. (Nasdaq:BRCM), a provider of semiconductor systems for wired and wireless communications, unveiled its latest system-on-a-chip (SoC) series designed to address the accelerating Ethernet Passive Optical Network (EPON) market.
The single-chip system enables faster time to revenue and more average revenue per unit (ARPU), while delivering the increased bandwidth needed to address the high-speed connectivity requirements of converging triple-play services (voice/video/data) in MDU applications, says a representative.
The BCM53600 series is the first in a family of optimized, 1G to 10G scalable, and integrated single-chip PON MDU SoCs. The BCM53600 series of highly integrated 1G-EPON SoCs delivers system integration, enabling carriers to deploy pizza-box applications with the fewest possible components and reducing system cost and power consumption.
The complete SoC includes an integrated switch, PHY, CPU, EPON MAC, voice DSP, and software development kit (SDK).
The feature set--including TR-101, TR-156, and CTC2.1 specification compliance--delivers end-to-end quality of service (QoS), classification, filtering, security, IPv6 support, and multiple interfaces for a smooth transition to evolving technology and multiple deployment scenarios, such as VDSL, VoIP, 10G-EPON, and GPON.