November 19, 2024
1:00 PM ET / 12:00 PM CT / 10:00 AM PT / 6:00 PM GMT GMT
Duration: 1 hour
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Summary
With increasing AI workloads, connectivity inside the data center has never been more important. Optical connectivity solutions are under enormous pressure to transmit more data faster, with lower latency and less power than ever. As data centers navigate the demands of artificial intelligence (AI), there’s a significant increase in the capacity of communication networks and the bit rates. Join us as we discuss the opportunities, challenges, and technologies enabling the realization and rapid adoption of cost-effective 800G and 1.6T+ optical connectivity solutions.
We’ll learn about getting more speed with less power during this webinar by addressing the following issues:
- Increasing the bit rate in data centers
- 400G transceiver limits
- The role of 800G transceivers
- Eying 1.6 Terabit capacity
- Powering and cooling issues
- How Thermal Interface Materials (TIM) can improve thermal transfer
Speakers
Robert Maher
CTO, OMCS
Infinera
Robert Maher, Ph.D., serves as SVP and CTO of Infinera’s Optical Modules and Coherent Solutions Group. He is responsible for defining the vision and technology roadmap for Infinera’s digital coherent technology, which includes DSP ASICs, photonic integrated circuits, and next-generation coherent pluggable modules.
Dr. Maher has authored over 120 technical publications in the field of optical transmission technologies and holds two patents. He is the recipient of the Marie Curie Research Fellowship from the European Research Council and the University Research Fellowship from the Royal Society (U.K.) for his innovative work. In recognition of his technical contributions to the optical industry, he was awarded Optica’s Paul F. Foreman Team Engineering Excellence Award and the Colin Campbell Mitchell Award from the Royal Academy of Engineering (U.K.). In 2015, he became a Senior Member of IEEE.
Tom Mitcheltree
Advanced Technology
US Conec
Tom Mitcheltree is the Advanced Technology Manager at US Conec, where he engages with the latest optical connectivity technologies for structured cabling, pluggable transceiver, and co-packaged optics solutions. With over 25 years of experience in telecom and datacom, Tom is a participating member of IEEE, OIF, QSFP-DD, OSFP, and OSFP-XD. He has been a contributing expert to IEC and TIA standards, including TIA-604-5 (FOCIS 5), TIA-604-18 (FOCIS 18), and IPC 8497-1. Tom holds a Bachelor of Science degree from Westminster College.
Zongyu Wang
PD Chemist
Henkel
Zongyu Wang, PD chemist for Henkel’s Adhesive Technologies business, supports the company’s thermal interface materials (TIMs) product development. With over 10 years research experience, Zongyu has expertise in polymer synthesis, inorganic/polymer hybrid nanocomposite preparation and characterizations, holds M.S. (Material Science & Engineering), and Ph.D. (Chemistry) from Carnegie Mellon University. In his current role, Zongyu Wang is focused on silicone-based thermal interface materials for the thin bond-line application and is based in Henkel’s Chanhassen, MN facility.
Moderator
Sean Buckley
Editor-in-Chief
LIGHTWAVE
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