SAN FRANCISCO--During this week’s OFC 2025 tradeshow, optical vendors are showcasing products that offer lower power and greater capacity to accommodate the growth of hyperscale data center operators delivering AI services and traditional providers expanding their broadband services.
In our first installment of the ECOC 2024 product showcase, we highlight innovations from Adtran, LESSENGERS, Lumentum and TeraSignal.
Adtran’s FSP 3000 addresses optical line systems management
Adtran launched its new FSP 3000 IP OLS solution with the aim of helping service providers and enterprises bring hyperscale efficiency to their networks. Enabling a shift to simpler, more automated architectures, the FSP 3000 combines amplification, filtering and real-time fiber and optical channel monitoring into a compact design as small as 1RU, it automates key operational tasks and reduces complexity. With built-in scalability, the plug-and-play open line system enables rapid capacity expansion from 400G to 800G and 1.6Tbps per wavelength. Furthermore, with Adtran's optical infrastructure-as-a-service offering, the FSP 3000 IP OLS enables a turnkey approach that streamlines operations and reduces overhead.
Lessengers new 1.6T transceiver addresses hyperscale data center bandwidth and energy consumption crunch
LESSENGERS has debuted a 1.6T OSFP 2×SR4 optical transceiver with multimode optics to address the growing bandwidth and energy crunch resulting from the increasingly complex AI/ML workloads in hyperscale data centers. Hyperscale data centers require increasingly higher bandwidth and lower latency to keep up with the massive data processing demands. This drives the need for 1.6 Tbps optical transceivers, which offer the highest bandwidth available today and will play a crucial role in ensuring efficient and high-speed data transfer between compute, storage, and networking nodes. Lessengers products are based on the company’s DOW technology, a polymer-based air-cladded waveguide technology that is particularly useful for optical interconnects in the data center and high-performance computing environments.
Lightmatter’s Passage L200 co-packaged optics platform focuses on eliminating bandwidth bottlenecks
Lightmatter has debuted Passage™ L200, a 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and switch silicon designs, Passage L200 3D CPO family includes both 32 Tbps and 64 Tbps versions, representing what it claims are a 5 to 10x improvement over existing solutions. This enables over 200 Tbps of total I/O bandwidth per chip package, resulting in what it claims to be up to 8X faster training time for advanced AI models. The Passage L200 3D CPO integrates the latest of Alphawave Semi’s chiplet technology portfolio, combining silicon-proven low power and low latency UCIe and optics-ready SerDes with Lightmatter’s integrated circuit (PIC). Alphawave Semi’s advanced-node electrical integrated circuit (EIC) is 3D integrated on the Passage PIC using standard chip-on-wafer (CoW) techniques. Passage 3D integration enables SerDes I/O to be positioned anywhere on the die, rather than being confined to its shoreline, delivering the equivalent bandwidth of 40 pluggable optical transceivers per L200. Additionally, multiple L200s can be integrated into a package to serve a broad range of XPU and switch applications.
Lumentum Optical Circuit Switch to Improve Next-Generation AI Data Center Scalability
Lumentum is currently sampling its R300 optical circuit switch (OCS) 300x300 port product, which is being tested with multiple hyperscale customers and is slated for general availability in the second half of 2025. The R300 is a breakthrough solution designed to enhance the scalability, performance, and efficiency of artificial intelligence (AI) clusters and intra-data-center networks. As hyperscalers scale AI infrastructure to meet surging demand, optical switching offers a power-efficient, cost-effective, and reliable alternative to traditional Ethernet-based architectures. Lumentum estimates that adopting its OCS can reduce overall AI data center network power consumption by 65% or more in 100K-scale GPU deployments compared to InfiniBand or Ethernet solutions. Market research firm Cignal AI projects that the OCS market will surpass $1B by 2028, driven by AI and cloud network advancements.
TeraSignal unveils 4x200G Intelligent TIA for 1.6T Optical Interconnects
TeraSignal has introduced the TS9801/02, a quad 200G PAM-4 linear Transimpedance
Amplifier (TIA) with TSLinkTM Digital Eye Monitoring (DEM) and adaptive equalization. As AI infrastructure moves toward higher-density optical interconnects and tighter power budgets, the TS9801/02 enables data center operators to scale efficiently, delivering the analog performance and built-in link diagnostics needed for reliable deployment of low-power 1.6T LRO modules. The TeraSignal TS9801/02 will sample to select customers in Q2 2025. TS9801 delivers exceptional noise performance, bandwidth, power efficiency, and dynamic range while minimizing crosstalk between channels for re-timed optics. TS9802 builds on the exceptional analog performance of TS9801, integrating TSLink™ DEM and adaptive equalization, two essential features currently absent in existing discrete TIAs. This new solution brings unmatched performance and real-time link diagnostics to all classes of linear optics including linear receive optics (LRO), linear pluggable optics (LPO), on-board optics (OBO) and co-packaged optics (CPO).