Teradyne expands photonic IC testing capabilities with Quantifi Photonics deal
Teradyne is acquiring privately held Quantifi Photonics to strengthen its presence in the photonic IC testing market segment.
The acquisition is expected to close in the second quarter of 2025 after meeting customer closing conditions and regulatory approval.
This acquisition will enable Teradyne to deliver scalable photonic integrated circuit (PIC) test solutions. PIC technology is leveraging wafer-based manufacturing, multi-die integration, and advanced packaging with high-speed I/O interfaces to enable the rapidly evolving high-performance compute market to support AI workloads.
Quantifi’s portfolio includes a wide range of photonic test instruments and digital sampling oscilloscopes, available as benchtop or in the industry-standard PXI format, to support design verification testing and high-volume manufacturing.
Greg Smith, Teradyne’s CEO, said that Quantifi Photonics will enable the company to “accelerate the development of cost-effective, high-throughput test solutions for wafer-level, die/multi-die and co-packaged optical module testing.”
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Sean Buckley
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