Unlike traditional interconnects that rely on DSPs, which increase power consumption and latency, TeraSignal's TSLink removes these bottlenecks by eliminating the need for DSPs. This innovation reduces power consumption by at least 50% and minimizes latency, addressing critical demands for efficiency and scalability in AI and high-performance computing environments. TSLink is optimized for AI infrastructure, data centers, high-performance computing, and other environments requiring high-speed, reliable interconnects. TSLink can interface seamlessly with existing ASICs and simplifies the process of connecting ASICs to various types of linear optics such as linear pluggable optics (LPO), near package optics (NPO), co-packaged optics (CPO) and active copper cables (ACC). This plug-and-play capability streamlines and simplifies deployment, reducing the complexity typically associated with traditional high-speed interconnects.
JUDGE'S COMMENT: "TeraSignal's TSLink has the benefit of being an early mover in the emerging 800G linear pluggable optical (LPO) module market."