Infraeo’s OSFP1600 1.6Tbps linear redriver-powered active copper cable enables next-generation networking connectivity up to 3m. With the fine-tuned signal integrity engineering and manufacturing process, this linear redriver-powered cable emulates the passive copper interconnect performance where the networking SERDES may treat the cable as passive copper interconnects to support error-free and robust next-generation 1.6Tbps data communication. The enhanced OSFP1600 case design further improves the cable's high-temperature performance, where signal integrity performance degradation is minimized while operating at 70+ degrees celcius. By integrating a patent-pending sandwiched copper+TIM (thermal interface material) chip-to-case heat spreader that pushes the conductivity towards 10W/mK and the industry's air-dynamic heatsink that provides the best airflow impedance, the active copper cable engineered by Infraeo delivers unbeatable performance in thermal management for applications where power consumption and thermal management are stressed.
JUDGE’S COMMENT: “Shorter-reach solutions like this will be key in AI clusters.”