US Conec’s Very Small Form Factor (VSFF) multi-fiber MMC connector addresses the demand for optical fiber increases to support the growth in artificial intelligence (AI), speed of deployment, performance and reliability demands across the many cabling infrastructure links within a data center. Leveraging the same precision alignment structure as the MPO, the MMC connector takes advantage of the standardized 250 µm fiber hole pitch and the diameter and pitch of the guide bore holes to provide a reliable connectivity solution compatible with existing industry ecosystems. The MMC connector enables high-density patch panels, allowing deployment of over 6,000 fibers per rack unit when using a 2x12F MMC configuration. The MMC platform not only supports high-density patch panels but, with low-loss performance and variants optimized for space-constrained environments, also enables the use of pre-connectorized solutions in pathways previously considered not possible, improving the speed of deployment for data center cabling.
JUDGE'S COMMENT: "Having a much smaller multi-fiber push on (MPO) connector supporting greater densities and option to pull as pre-connectorized cable with the same specifications are a great benefit for data center operators."