Source Photonics' 800G DR8/DR8+ and 400G DR4/DR4+ 2PIC transceivers for immersion cooling address a new emerging AI data center market for optical modules operated in environments using immersion cooling for efficient power saving. The existing non-hermetic design approaches like chip-on-board (COB) design of optical modules won’t be suitable for immersion cooling, so this requires we have to dramatically redesign the optical solution from scratch, including the innovative PCBA design and redesign of Tx and Rx optical sub-assembly (TOSA & ROSA) with “Golden Box” hermetic packaging and properly sealing of any optical path exposed to open air with optical fiber pigtails.
JUDGE'S COMMENT: "Immersion cooling is the future of hyperscale computing, and it is sending component providers back to the lab. This offering is exemplary of innovation in that realm."