NOVEMBER 22, 2006 -- Polymer System EP30-1, recently developed by Master Bond Inc. (search for Master Bond), is a low-viscosity, two-component epoxy compound for high-performance fiber-optics bonding, coating, potting, and encapsulation. EP30-1 is formulated to cure at room temperature or more rapidly at elevated temperatures, with a 4:1 mix ratio by weight.
The compound is 100% reactive and does not contain any solvents or other volatiles, Master Bond says. The company especially recommends it where low viscosity is required for ease of application and bonded, coated, or cast assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is 0.0003 inches/in. The cured epoxy resin compound has a spectral transmittance of over 97% (3100-9000 A).
Master Bond asserts the Polymer System EP30-1 produces high-strength rigid bonds, coatings, and castings with excellent chemical resistance to water, oil, and most organic solvents, over the temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers, and many plastics is excellent, the company adds. The hardened material is an excellent electrical insulator. Color of part A is clear, part B clear.
Master Bond claims its Polymer System EP30-1 is widely used in the fiber-optics field for applications ranging from bonding ferrules and connectors to potting LED devices as well as fiber optics components.
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