Source Photonics released its 200 Gbps PAM4 EML CoC (chip-on-carrier) products, initially demonstrated as a TOSA prototype during OFC 2023. It began production release to selected customers and was adopted internally in their newest 800G DR4/FR4 OSFP/QSFP-DD, 800G LR4 OSFP and 1.6T DR8/2xFR4 OSFP-XD designs. Targeting to support next-gen hyperscale and AI/ML data centers’ need for higher speeds and network capacity, Source Photonics is adding 200G PAM4 EML chips to its EML portfolio, including 28GBd and 56GBd EMLs.
Judge’s Comment: “This product is essential to the continued speed increases of the industry.”