StockerYale introduces bend insensitive fiber

Dec. 23, 2002
December 23, 2002--StockerYale Inc., an independent designer and manufacturer of specialty optical fiber, presented its new line of bend insensitive fiber, designed for improved bend performance in reduced radius applications.

StockerYale Inc., an independent designer and manufacturer of specialty optical fiber, presented its new line of bend insensitive fiber, designed for improved bend performance in reduced radius applications.

The company's bend insensitive fiber employs a moderately higher numerical aperture (NA) than standard single-mode telecom fibers. The moderate NA delivers lower bend loss at 1310 and 1550 nm without significantly affecting splicing performance and is available in a 125 µm- or 80 µm-clad diameter.

StockerYale's bend insensitive fiber is ideal for tight bend radius conditions, multiple fiber wraps on a mandrel, fused fiber couplers, and sensors. The company's team of scientists and engineers can also custom design a bend insensitive fiber that meets a customer's exact specifications.

For more information about StockerYale Inc. (Salem, NH), visit the company website at www.stockeryale.com.

Sponsored Recommendations

How AI is driving new thinking in the optical industry

Sept. 30, 2024
Join us for an interactive roundtable webinar highlighting the results of an Endeavor Business Media survey to identify how optical technologies can support AI workflows by balancing...

On Topic: Optical Players Race to Stay Pace With the AI Revolution

Sept. 18, 2024
The optical industry is moving fast with new approaches to satisfying the ever-growing demand from hyperscalers, which are balancing growing bandwidth demands with power efficiency...

The AI and ML Opportunity

Sept. 30, 2024
Join our AI and ML Opportunity webinar to explore how cutting-edge network infrastructure and innovative technologies can meet the soaring demands of AI memory and bandwidth, ...

Advances in Fiber & Cable

Oct. 3, 2024
Attend this robust webinar where advancements in materials for greater durability and scalable solutions for future-proofing networks are discussed.