Palomar Technologies delivers a Total Process Solution™ for advanced photonic and microelectronic device assembly processes. Palomar offers die bonders, wire and wedge bonders, vacuum reflow systems, along with outsourced manufacturing.
Contract assembly, process development, test and prototyping division of Palomar Technologies for high-precision, high-accuracy die attach and wire bonding services without having...
High-speed, fully automated precision component assembly and offers extraordinary micron-level placement accuracy for photonic, wireless and medical applications. Has configuration...
The highly flexible, computer-controlled work cell performs up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a...
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