Multicore Fiber Interconnection for Next-Generation Connectivity
HYC Co., Ltd, a global passive optical devices manufacturer, will showcase its latest complete series of MCF (Multicore Fiber) passive subassemblies at OFC2025 (April 1-3, Booth #3020).
The rapid development of information and communication technology is driving the demand for higher data transmission rates, ushering in the era of Multicore Fiber (MCF). MCF is considered an effective solution for overcoming the Shannon capacity limit of the current optical communication system, enabling a significant exponential increase in bandwidth capacity. To fully implement MCF technology, it is crucial to address both MCF-to-MCF connectivity and connections between MCFs and single-mode fibers (SMF).
MCF fan-in/fan-out (FIFO) devices are used to connect MCFs to existing SMFs, realizing multiplexing and demultiplexing functions. There are four commonly used technologies for FI/FO devices: Bundle, Space Optics, 3D Waveguide, and Fused Tapering. Each method has its advantages tailored to different application scenarios. HYC has developed FI/FO devices utilizing both Bundle and Space Optics technologies and is developing 3D Waveguide technology. Its FI/FO has a compact size of just L25 × φ2.5mm and is ready for mass production.
Additionally, HYC has developed MCF LC/SC connectors for MCF-to-MCF connections, allowing them to be used like traditional single-core optical fibers. The MCF LC/SC connectors are modified and designed based on the traditional LC/FC connector, with optimized positioning and maintaining functions and enhanced grinding and coupling processes, ensuring minimal insertion loss variation even after multiple couplings. The insertion loss can be as low as 0.35 dB, while the return loss reaches ≥45 dB (UPC).
HYC works closely with customers during the product design-in stage, providing a range of customized passive solutions for MCF. In addition to MCF FI/FO devices and MCF connectors, HYC also offers MCF solutions for use inside optical transceivers and MCF hybrid devices used in MC-EDFA (Multi-core Erbium-Doped Fiber Amplifiers) systems, such as 980/1550nm WDM and Gain Flattening Filters (GFF), among others.
HYC will showcase all these MCF devices at OFC 2025 from April 1 to 3. Visit us at Booth 3020 to explore how HYC’s advanced MCF solutions can drive the future of high-capacity optical communication.
About HYC Co., LTD
HYC Co., Ltd. is a global provider of passive optical devices, specializing in the research, development, manufacturing, and customization of fiber optic solutions. With over two decades of expertise, HYC offers a comprehensive portfolio of passive optical devices, including fiber connectivity (MPO/MTP, LC, SC assemblies), highly integrated subassemblies for transceivers, multicore fiber subassemblies, PLC splitters, and WDM (CWDM/DWDM/AWG) products. Supported by a strong R&D team and large-scale production capacity, HYC operates manufacturing facilities in both Thailand and China to meet global demand.
More information about HYC: https://www.hyc-system.com