Highly Integrated Subassemblies for 800G/1.6T SiPh Transceivers
The rapid growth of artificial intelligence (AI) and large language models has led to a surge in demand for high-speed optical transceivers within data centers and AI cluster computers. Data transfer rates and energy consumption are being pushed to unprecedented levels, with transceiver speeds scaling from 100 Gbps to 400 Gbps, rapidly progressing to 800 Gbps, reaching up to 1.6 Tbps and beyond.
This evolution in high-speed networking not only enhances the transmission capabilities of optical transceivers but also raises stringent demands on interconnection subassemblies for higher reliability, superior coupling efficiency, and compact designs. Leveraging seven core technology platforms, HYC provides comprehensive subassembly solutions for high-speed optical transceivers, which will be showcased at OFC 2025.
a) Eight Basic Components
HYC has established a robust foundation of eight essential components for high-speed optical subassemblies: MT/Mini MT, Jumper, fiber array (FA), Receptacles, free-space isolators (FSI), fiber lens array, block, and prism. These components serve as the building blocks for various customized subassembly solutions, such as 2×MT-3×FA, FA + Isolator, FA + Lens array, and more.
b) Parallel Optics Subassemblies for 400G/800G/1.6T DR/PSM Transceivers
Typical products are MT-FA + lens array for 800G silicon photonics modules, FA + isolator, Receptacle-Collimator, etc.
A new product, the MT-FA with an attached lens array, is designed for the Rx end of optical transceivers. By bonding the lens array to the FA, it effectively focuses light onto the photodetector (PD), significantly improving coupling efficiency. This solution not only simplifies optical module packaging but also reduces assembly complexity and costs. Utilizing HYC’s optical design, simulation, and ray-tracing core technology platform, the optical path is precisely engineered to ensure alignment with PD (typ. ≤16 µm), achieving high coupling efficiency while maintaining a return loss of over 45 dB, thereby enhancing the optical performance of high-speed transceivers.
c) WDM Optics Subassemblies for 400G/800G/1.6T FR/LR Transceivers
Typical WDM optics subassemblies for FR/LR transceivers include Z-block integrated subassemblies and PLC-based CWDM/DWDM/MWDM solutions. Z-block subassemblies integrate key components of the optical transceiver's receiver (Rx) or transmitter (Tx), such as a receptacle, collimator, Z-block, lens array, free space circulators, prism, etc., significantly simplifying optical module assembly and coupling. The core technology of these products lies in the capabilities of optical simulation, precision optical coupling, and back-end processing.
HYC's back-end processing platform enables high-precision fabrication of lenses, prisms, and filters. It offers a full range of back-end processing capabilities, including cutting, grinding, polishing, bonding, bar testing, pitch testing, cleaning, and inspection, ensuring superior optical performance and integration efficiency.
A newly developed 800G BIDI (Tx+Rx) subassembly integrates a receptacle, collimator, free-space circulator, and Z-block for bidirectional (BIDI) single-fiber transceivers, enhancing efficiency.
d) MCF Subassemblies for Next-gen MCF-Based High-Speed Transceivers
Multicore fiber (MCF) is considered an effective solution for overcoming the Shannon capacity limit of the current optical communication system, enabling a significant exponential increase in bandwidth capacity. To fully implement MCF technology, it is crucial to address both MCF-to-MCF connectivity and connections between MCFs and single-mode fibers (SMF). HYC offers MCF subassemblies solutions for next-generation space-division multiplexing (SDM) MCF-based transceivers (e.g. 4-core receptacle-FA), to address the growing bandwidth demands of future high-speed networks.
All solutions are tailored to meet customer-specific requirements, leveraging HYC’s strong R&D capabilities to drive customized product development. From the initial design-in phase, we collaborate closely with customers to co-engineer solutions, ensuring optimal performance and seamless integration. At OFC 2025, HYC will showcase these highly integrated subassemblies for 800G/1.6T, SiPh, and next-generation transceivers. We warmly invite industry partners to visit our booth (3020) and explore the future of high-speed optical interconnects together. See you at OFC 2025!
About HYC Co., LTD
HYC Co., Ltd. is a global provider of passive optical devices, specializing in the research, development, manufacturing, and customization of fiber optic solutions. With over two decades of expertise, HYC offers a comprehensive portfolio of passive optical devices, including fiber connectivity (MPO/MTP, LC, SC assemblies), highly integrated subassemblies for transceivers, multicore fiber subassemblies, PLC splitters, and WDM (CWDM/DWDM/AWG) products. Supported by a strong R&D team and large-scale production capacity, HYC operates manufacturing facilities in both Thailand and China to meet global demand.
More information about HYC: https://www.hyc-system.com