Senko and US Conec settle patent disputes

Sept. 3, 2024
Each company will retain its portfolio of VSFF patents.

On September 3, Senko Advanced Components, Inc. and US Conec Ltd. announced that the patent infringement dispute between the companies has been settled.

According to a press release from US Conec, “Senko Advanced Components, Inc. and US Conec Ltd. have settled their patent infringement disputes regarding very small form factor fiber optic connectors and adapters (“VSFF Products”). All pending lawsuits on this subject matter are dismissed, as are administrative challenges to the parties' patents in the United States Patent & Trademark Office. As a result, each party retains its current portfolio of patents covering VSFF Products that were at issue in those cases. Under the terms of the agreement, both parties and their licensees, distributors, and customers may continue to offer their current VSFF Products. Also as part of their settlement, Senko will be able to offer MMC connector and adapter products, and US Conec will be able to offer SN connector and adapter products. The parties have also resolved patent disputes regarding MPO products so that both parties and their licensees, distributors, and customers may continue to provide their respective MPO products. The remaining provisions of the parties’ agreement remain confidential.”

Senko first filed a lawsuit against US Conec in January 2023, alleging patent infringement on VSFF fiber optic connectors and adapters. Following this initial action, US Conec filed complaints with the International Trade Commission (ITC) as well as lawsuits alleging numerous instances of patent infringement.

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About the Author

Hayden Beeson

Hayden Beeson is a writer and editor with over seven years of experience in a variety of industries. Prior to joining Lightwave and Broadband Technology Report, he was the associate editor of Architectural SSL and LEDs Magazine. 

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