OIF members to demonstrate physical and link layer interoperability at SuperComm 2003
22 May 2003 Fremont, CA Lightwave -- The Optical Internetworking Forum (OIF) announced that 15 member companies will demonstrate interoperability of the Forum's Physical and Link Layer (PLL) architecture at SUPERCOMM 2003 in Atlanta, June 3-5, Booth #10205. As a part of SUPERCOMM's SUPERDemo program, the OIF will also introduce its newest project, the Common Electrical I/O (CEI).
"The OIF's PLL Working Group is producing some incredibly original technical work," contends Joe Berthold, Ciena Corp., president of the OIF. "This demonstration will highlight the real progress that we are making in that area and give our members an opportunity to show the strides they have made in making their products work together to build a better network."
"It's not only the chips that have to be faster and more efficient. Today, it is increasingly essential that the development effort is also fast and efficient," adds Karen Liu, managing director with RHK's Advisory Services group. "The broad range of companies participating in the OIF PLL Interoperability Demo demonstrates widespread recognition of that need. The activity of the OIF is a sign of increasing maturity in the optical communications industry."
The live SUPERDemo will feature the first demonstration of the OIF's CEI work in progress with demonstrations of electrical interfaces with signaling rates of 6+ and 11+ Gbits for chip-to-chip, chip-to-optical module, and electrical backplane applications. Participant companies will include ASSP, FPGA, ASIC, optical module, transmission channel, and test equipment vendors highlighting protocol testers; signal-integrity measurement equipment, including eye diagrams and jitter measurements; video generation; and display equipment.
The demonstration will also highlight the Serdes Framer Interface for a common electrical interface between SONET framer and serial/deserializer parts for OC-192 interfaces (SFI-4.1 IA); the System Packet Interface Level 4, Phase 2: System Interface for Physical and Link Layer Devices (SPI-4.2 IA); and the OIF's tunable laser IA. These electrical interfaces define the transport protocol between ICs in equipment chassis at 10- and 40-Gbit/sec aggregate rates.
The companies that will participate in the OIF's interoperability demonstration at SUPERCOMM 2003 include Agilent Technologies, AMCC, BitBlitz Communications, Gennum Corp., Ignis Optics, Infineon Technologies, Iolon, Multiplex, NEC Electronics America, Santur, Tyco Electronics, Velio, Vitesse, Winchester Electronics, and Xilinx.
Members of the OIF will be providing technical presentations based on the Forum's ongoing work in the theater area of the booth. For the schedule of presentations visit: < ahref=http://www.oiforum.com/public/supercomm_2003.html>www.oiforum.com/public/supercomm_2003.html. The OIF booth will also include a multimedia presentation on the OIF's UNI/NNI interoperability demonstration that took place in early 2003.