The first public prototype of a Generic Access Platform (GAP) node will debut at SCTE/ISBE Cable-Tec Expo this fall.
The GAP node, which utilizes standardized physical, thermal, mechanical and electrical interfaces, has been a collaborative effort of Charter Communications, AOI, ATX Networks, Cisco, Intel and Silicom in conjunction with other participants in the SCTE/ISBE Standards organization's GAP working group. GAP nodes are intended to simplify the ability of cable operators to update access technologies, and to evolve their networks through the addition of new functionality to nodes in the field.
Prototypes will be shown on the Cable-Tec Expo exhibit floor by ATX, Cisco and Intel. Each of the partners will also be featured discussing the concept in "Closing the GAP to HFC Network Densification," a presentation at 3 p.m. on Oct. 1 in the Innovation Theater on the Expo exhibit floor. Expo will be held from Sept. 30 through Oct. 3 at the Ernest N. Morial Convention Center in New Orleans.
"The wide variety of proprietary interfaces in deployed nodes has been an obstacle to deployment of next generation technologies and services," said Matt Petersen, vice president, Access Architecture, for Charter Communications. "The Cable-Tec Expo prototype has helped advance the GAP specification through a DevOps approach and is anticipated to be a steppingstone toward commercially available GAP nodes that can simplify current and future service delivery."
Powered by Intel processors, the GAP prototype is intended to address the challenges of serving multiple access technologies across DOCSIS, wireless and fiber networks. GAP enclosures also are intended to house high-performance compute modules needed to implement edge computing to reduce upstream traffic and data center loads while improving latency.