MACOM MATA-03819: Four channel, 106G (53 GB PAM4) Linear TIA for 400G Optical Modules

Feb. 21, 2018
MACOM's TIAs, available in die for wire-bonding (MATA-03819) and die for flip chip (MATA-03820) applications, enable an economical transition to next-generation 400G Ethernet, HDR InfiniBand, and OTN applications by delivering best-in-class performance for 53-GB PAM4 and legacy 28-GB PAM4 and 25G NRZ connectivity.

MACOM's TIAs, available in die for wire-bonding (MATA-03819) and die for flip chip (MATA-03820) applications, enable an economical transition to next-generation 400G Ethernet, HDR InfiniBand, and OTN applications by delivering best-in-class performance for 53-GB PAM4 and legacy 28-GB PAM4 and 25G NRZ connectivity.

The MATA-03819/MATA-03820 feature high bandwidth, high sensitivity, and low power consumption technology.

Judge's Comment: "MACOM's four-channel 53-Gbaud PAM4 linear TIA is an industry leading, highly integrated solution with a very low power consumption of 220 mW per channel to enable next-generation 400G pluggable applications."

Click here to return to the 2018 Lightwave Innovation Reviews page.

Sponsored Recommendations

On Topic: Fiber - The Rural Equation

Oct. 29, 2024
RURAL BROADBAND:AN OPPORTUNITY AND A CHALLENGE The rural broadband market has always been a challenge for service providers. However, the recent COVID-19 pandemic highlighted ...

The Road to 800G/1.6T in the Data Center

Oct. 31, 2024
Join us as we discuss the opportunities, challenges, and technologies enabling the realization and rapid adoption of cost-effective 800G and 1.6T+ optical connectivity solutions...

High-Speed Networking Event

Oct. 23, 2024
A Multi-Day online learning event crafted for optical communications professionals specializing in high-speed networking solutions Date: November 12-14Platinum Sponsor: AFLGold...

Advances in Fiber & Cable

Oct. 3, 2024
Attend this robust webinar where advancements in materials for greater durability and scalable solutions for future-proofing networks are discussed.