SFP-DD MSA releases first module specifications

Sept. 19, 2017
The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group says it has finished the initial hardware specification and drawings for its pluggable interface. As previously announced, the SFP-DD expands upon the widely deployed SFP module form factor to support higher transmission rates than its progenitor in a 3.5-W package.

The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group says it has finished the initial hardware specification and drawings for its pluggable interface. As previously announced (see "SFP-DD MSA targets 50-Gbps, 100-Gbps optical transceivers"), the SFP-DD expands upon the widely deployed SFP module form factor to support higher transmission rates than its progenitor in a 3.5-W package.

For example, the SFP has a single-lane electrical interface that accommodates up to 28 Gbps via NRZ or 56 Gbps via PAM4. The SFP-DD has a two-lane electrical interface, with each lane supporting up to 25 Gbps with NRZ or 56 Gbps via PAM4 to enable aggregate bandwidth of 56 Gbps or 112 Gbps.

The SFP-DD hardware specification and drawings, available on the MSA's website, define the module, plug, and cage characteristics. Modules and direct-attach cable plugs use a common mechanical outline. Modules and plugs can self-lock with the cage when inserted. The MSA lists the following as significant features within the specification:

  • A single-port SMT connector and cage
  • Heat sink options for flexible thermal management
  • Module mechanical definition
  • Support for optical and copper interfaces; physical layer specifications will be determined outside the scope of the SFP-DD MSA, the group says.

The SFP-DD cage/connector system will be backwards compatible with all current SFP-style interfaces, the MSA members assert. Founding members include Alibaba, Broadcom, Brocade, Cisco, Dell EMC, Finisar, Hewlett Packard Enterprise, Huawei, Intel, Juniper Networks, Lumentum, Mellanox Technologies, Molex, and TE Connectivity.

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