Attendees at the European Conference and Exhibition on Optical Communications (ECOC) in Amsterdam September 16-20 will have the opportunity to see two Optical Internetworking Forum (OIF) interface specifications in action at stand 269. The OIF will host a multi-vendor demonstration of the CEI-25G-LR and draft CEI-28G-VSR implementation agreements for high-speed multichannel communications at the show.
The OIF's Physical and Link Layer demonstrations will include host ASICs with VSR SerDes, host PCB traces, optical module connectors, module retimers, active copper cable assemblies, optical transceivers, host ASICs with LR SerDes, backplane PCBs, and backplane connectors.
Seven component suppliers and two test equipment vendors will participate in the demonstration. The former include Applied Micro, Avago Technologies, Inphi, Luxtera, Molex, Semtech, and TE Connectivity. Agilent and Tektronix will supply test equipment.
“This demonstration of CEI-28G-VSR shows the ability to reach 100G for next-generation small form factor modules,” said Ed Frlan of Semtech and the OIF PLL Interoperability Working Group chair. “The CEI-25G-LR and CEI-28G-VSR electrical interface and signaling schemes being tested for interoperability support both electrical and optical 100G applications.”